Itronsvs Factory-Zhejiang Itronsvs Technology Service Co., Ltd.

Who
are we

SMT patch factory is located in Zhejiang

Technology small and medium-sized enterprises

Patch proofing starts in one piece

7 high-speed patch lines/1 proofing line/2 plug-in lines/2 finished product assembly lines
Our
advantage

An average of more than 15 years of experience in management

Team authority

Certified quality is traceable

Fast delivery, on time delivery
Why
choose us

Components in stock warehouse, minimum order of 1 piece

Whatever you need, we can deliver it within 24 hours

TPS quality control system, quality assurance

Diversified cooperation methods such as contracting work and materials, processing with supplied materials, etc.

Zhejiang Itronsvs Technology Service Co., Ltd.

SMT Production Capacity

8 million solder points/day

SMT Production Line

7 high-speed patch lines, 1 patch proofing line

Throwing Rate

Resistance and capacity ratio 0.3%

IC type no throwing materials

Board Type

POP/ordinary board/FPC/rigid-flex board/metal substrate

Mounted Component Specifications

The smallest package that can be attached: 01005 Chip/0.4 Pitch BGA QFN

Minimum device accuracy: ±0.2mm

IC patch accuracy: ±0.2mm

Mount PCB Specifications

PCB size: 150*150mm - 510*460mm

PCB thickness: 0.3-6.5mm

Assembly test

General process flow for assembly and test workshops

Structural Component Assembly

Number Writing On The Whole Machine

Vibration Test

Aging Test

Function Test

Label Appearance

Whole Machine Packaging

Overall capacity of the assembly and test shop

Processing flow

IPQC random inspection throughout the process

Material procurement, processing and inspection
The material buyer conducts the original purchase of materials based on the BOM list provided by the customer to ensure that the production is basically correct. After the purchase is completed, the materials are inspected and processed to better ensure production quality.
silk screen
Screen printing is the first step in the SMT processing process. Silk screen printing refers to printing solder paste or SMD glue onto the PCB board pads to prepare for component soldering. If the stencil used for screen printing is not provided by the customer, the processor needs to make it according to the stencil file. At the same time, since the solder paste used must be stored frozen, the solder paste needs to be thawed to a suitable temperature in advance. The solder paste printing thickness is also related to the squeegee and should be adjusted according to the PCB board processing requirements.
Placement
Through the functions of suction-displacement-positioning-placement, the placement machine can quickly and accurately mount SMC/SMD components to the designated pad positions on the PCB board without damaging the components and the printed circuit board. .
Reflow soldering
Reflow soldering is the mechanical and electrical connection between the solder ends or pins of surface-mounted components and the printed board pads by remelting the paste-packed solder that has been pre-distributed on the printed board pads. It mainly relies on the effect of hot air flow on the solder joints. The colloidal flux physically reacts under a certain high-temperature air flow to achieve SMD welding.
Testing and repair
Inspection is to conduct welding quality inspection and assembly quality inspection on the assembled PCBA circuit board. AOI optical inspection, flying probe tester and ICT and FCT functional testing are required. SMT rework is usually to remove components that have lost functionality, have damaged pins, or are arranged incorrectly, and to replace them with new ones. The PCB board needs to be visually inspected to check whether components are missing, wrongly oriented, soldered, short-circuited, etc. If necessary, the board in question needs to be sent to a professional rework station for repair.
Dispensing glue
In SMT processing, the glue used for dispensing is red glue. Drop the red glue on the PCB to fix the components to be soldered and prevent the electronic components from falling or falling due to their own weight or unfixedness during the reflow soldering process. Welding. Dispensing can be divided into manual dispensing or automatic dispensing, which should be confirmed according to process needs.
Clean
After completing the soldering process, the board surface needs to be cleaned to remove rosin flux and some solder balls to prevent them from causing short circuits between components. Cleaning is to place the welded PCB board in a cleaning machine to remove the harmful flux residue on the surface of the PCB assembly board or the flux residue after reflow soldering and manual soldering, as well as the pollutants caused during the assembly process.
solidify
Curing is to melt the patch adhesive and fix the surface mount components on the PCB pad. It is generally thermally cured.